Relife RL-601MA CPU Lower Layer BGA Reballing Platform Set for iPhone 6 to 16Pro Max Apple A8 to A18
Features:
- iPhone CPU tin planting platform set suitable for A8/A9/A10/A11/A12/A13/A14/A15/A16/A17/A17 Pro/A18/A18 Pro CPU
- Automatic and precise alignment / Universal chip slot structure / Integration of positioning / Glue removal / Tin planting
- Using a new type of magnetic power original positioning, strong magnetic automatic clamping, convenient and flexible, support for a variety of CPU maintenance positioning, stable and reliable clamping
- Built-in high-temperature magnet, strong magnetic adsorption, precise positioning, no offset, high-temperature magnetic unchanged
- High-quality steel, round and square precise hole positions make the solder balls more rounded and prevent the mesh from jamming the solder balls
- Anti-drum, so that each solder ball is round and full, to meet the needs of various chips
- High quality environmentally friendly stone, high strength, anti-dirt, easy to clean
- Wear-resistant and anti-skid, shock absorption and compression resistance, anti-aging
Package includes:
- 1 x Fixture
- 11 x Steel mesh
Brand:
ReLife
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