Relife RL-601MA CPU Lower Layer BGA Reballing Platform Set for iPhone 6 to 16Pro Max Apple A8 to A18

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Relife RL-601MA CPU Lower Layer BGA Reballing Platform Set for iPhone 6 to 16Pro Max Apple A8 to A18


Features: 

  • iPhone CPU tin planting platform set suitable for A8/A9/A10/A11/A12/A13/A14/A15/A16/A17/A17 Pro/A18/A18 Pro CPU
  • Automatic and precise alignment / Universal chip slot structure / Integration of positioning / Glue removal / Tin planting
  • Using a new type of magnetic power original positioning, strong magnetic automatic clamping, convenient and flexible, support for a variety of CPU maintenance positioning, stable and reliable clamping
  • Built-in high-temperature magnet, strong magnetic adsorption, precise positioning, no offset, high-temperature magnetic unchanged
  • High-quality steel, round and square precise hole positions make the solder balls more rounded and prevent the mesh from jamming the solder balls
  • Anti-drum, so that each solder ball is round and full, to meet the needs of various chips
  • High quality environmentally friendly stone, high strength, anti-dirt, easy to clean
  • Wear-resistant and anti-skid, shock absorption and compression resistance, anti-aging


Package includes:

  • 1 x Fixture
  • 11 x Steel mesh
Brand:
ReLife

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