Low Temp Solder Paste for SMD IC BGA PCB Repair 138°C Lead-free Soldering Paste Needle Syringe Flux Tin No Clean Paste Welding

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Low Temp Solder Paste for SMD IC BGA PCB Repair 138°C Lead-free Soldering Paste Needle Syringe Flux Tin No Clean Paste Welding


Five competitive advantage

  • 1.High - Purity Solder Paste: 138 - Degree Melting Point, Anti - dry with Long Shelf Life This high - purity solder paste features a melting point of 138 degrees. It has anti - dry properties and a relatively long shelf life at room temperature, ensuring stable performance over time.
  • 2.Unique Formula Solder Paste: Solid Joints, No Bubbles or Cracks With a unique formula, this solder paste creates solid solder joints that are smooth, bright, and full, free from bubbles and cracks. It offers high - end quality and perfect performance.
  • 3.Push - Rod Design Solder Paste: Precise Application, Minimized Waste The innovative push - rod design allows for precise solder paste application, minimizing waste and making the soldering process smoother. Ideal for delicate IC, SMD, SMT, BGA repairs.
  • 5.Widely Applicable Solder Paste: Colorless Residue, Excellent Printing Performance This solder paste has colorless and transparent residue that doesn't affect detection. Using efficient energy thixotropic agents, it shows excellent and stable printing performance, improving welding quality.
  • Versatile Solder Paste: Suitable for Various Repairs, Including Desoldering Whether for IC/BGA component soldering, phone repairs, or home appliance work, this solder paste is versatile and can also be used for desoldering tasks.

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