LAIVOOT FT-FIX-11 Tempered Glass Clamp for Mobile Phone Repair Motherboard Chip Glue Removal and Tinning Clamping Tool

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LAIVOOT FT-FIX-11 Tempered Glass Clamp for Mobile Phone Repair Motherboard Chip Glue Removal and Tinning Clamping Tool

Features:
  • Precision Chip Holding: Secures BGA chips during de-soldering/reballing, prevents misalignment under microscopes.
  • Universal Phone Repair Fit: Works with iPhone logic boards, SAM CPUs, and HW chips (3.5cm width ideal for most sizes).
  • Tempered Glass Safety: Heat-resistant base protects work surfaces while allowing clear visibility of solder joints
  • Microscope-Optimized: Low-profile 1.7cm height fits under lenses for simultaneous operation and observation
  • Anti-Static & Non-Slip: Silicone pads avoid short circuits and keep delicate components firmly in place

Package includes:

  • 1 x Fixture

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