LAIVOOT FT-FIX-11 Tempered Glass Clamp for Mobile Phone Repair Motherboard Chip Glue Removal and Tinning Clamping Tool
- Precision Chip Holding: Secures BGA chips during de-soldering/reballing, prevents misalignment under microscopes.
- Universal Phone Repair Fit: Works with iPhone logic boards, SAM CPUs, and HW chips (3.5cm width ideal for most sizes).
- Tempered Glass Safety: Heat-resistant base protects work surfaces while allowing clear visibility of solder joints
- Microscope-Optimized: Low-profile 1.7cm height fits under lenses for simultaneous operation and observation
- Anti-Static & Non-Slip: Silicone pads avoid short circuits and keep delicate components firmly in place
Package includes:
- 1 x Fixture
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